[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - New Method for Evaluating Heat Transfer Material
Saito, Yasuhiro, Emoto, Hiroyuki, Tuji, Yuuki, Komuro, TakanoriYear:
2013
Language:
english
DOI:
10.1115/IPACK2013-73051
File:
PDF, 1.45 MB
english, 2013