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[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - Integration of a Multiple-Condenser Loop Heat Pipe in a Compact Air-Cooled Heat Sink
Kariya, H. Arthur, Hanks, Daniel F., Staats, Wayne L., Roche, Nicholas A., Cleary, Martin, Peters, Teresa B., Brisson, John G., Wang, Evelyn N.Year:
2013
Language:
english
DOI:
10.1115/IPACK2013-73120
File:
PDF, 1.35 MB
english, 2013