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A Finite-Element and Experimental Analysis of Stress Distribution in Various Shear Tests for Solder Joints
Reinikainen, T., Poech, M., Krumm, M., Kivilahti, J.Volume:
120
Year:
1998
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2792277
File:
PDF, 879 KB
english, 1998