[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (Sunday 6 July 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2 - Insertion of HDI and Grid Array Technologies Into Military/Space Applications
Keller, Jerry D.Year:
2003
Language:
english
DOI:
10.1115/IPACK2003-35248
File:
PDF, 2.67 MB
english, 2003