Removal mechanism of sapphire substrates (0001, 112̄0 and 101̄0) in mechanical planarization machining
Luo, Qiufa, Lu, Jing, Xu, Xipeng, Jiang, FengLanguage:
english
Journal:
Ceramics International
DOI:
10.1016/j.ceramint.2017.08.194
Date:
September, 2017
File:
PDF, 878 KB
english, 2017