Packaging of High-Gain Multichip Module in Multilayer LCP...

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IEEE Transactions on Components Packaging and Manufacturing Technology 2017

Packaging of High-Gain Multichip Module in Multilayer LCP Substrates at W-Band

Zhang, Yifei, Shi, Shouyuan, Martin, Richard D., Wright, Andrew A., Yao, Peng, Shreve, Kevin, Harrity, Charles, Prather, Dennis W.
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Year:
2017
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2017.2737550
File:
PDF, 2.64 MB
english, 2017
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