Controlled Electrodeposition of Uniform Copper Powder from Hydrochloric Acid Solutions
Jin, Wei, Su, Junling, Zheng, Shili, Lei, HongVolume:
164
Year:
2017
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/2.1491712jes
File:
PDF, 1.08 MB
english, 2017