![](/img/cover-not-exists.png)
[ASME ASME 2016 International Mechanical Engineering Congress and Exposition - Phoenix, Arizona, USA (Friday 11 November 2016)] Volume 10: Micro- and Nano-Systems Engineering and Packaging - High Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method
Sankarasubramanian, Santosh, Cruz, Jaime, Yazzie, Kyle, Sundar, Vaasavi, Subramanian, Vijay, Cetegen, Edvin, McCoy, David, Malatkar, PramodYear:
2016
Language:
english
DOI:
10.1115/imece2016-67007
File:
PDF, 1.53 MB
english, 2016