Onboard Device Encapsulation With Two-Phase Cooling
Young, S. J., Janssen, D., Wenzel, E. A., Shadakofsky, B. M., Kulacki, F. A.Volume:
10
Language:
english
Journal:
Journal of Thermal Science and Engineering Applications
DOI:
10.1115/1.4037130
Date:
August, 2017
File:
PDF, 3.89 MB
english, 2017