[ASME ASME 2003 International Mechanical Engineering Congress and Exposition - Washington, DC, USA (November 15–21, 2003)] Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology - Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5Sn3.9Ag0.6Cu Lead-Free Solder Paste on PCBs (Printed Circuit Boards)
Lau, John, Dauksher, WalterVolume:
2003
Year:
2003
Language:
english
DOI:
10.1115/IMECE2003-55041
File:
PDF, 1.12 MB
english, 2003