![](/img/cover-not-exists.png)
[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2 - Investigation of Effect of Wiring Patterns on In-Plane Thermal Conductivity of Printed Circuit Boards
Nakano, Yuta, Hatakeyama, Tomoyuki, Ishizuka, Masaru, Nakagawa, Shinji, Hirokawa, Masataka, Tomimura, ToshioYear:
2011
Language:
english
DOI:
10.1115/IPACK2011-52106
File:
PDF, 734 KB
english, 2011