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Chemical Mechanical Polishing (CMP) of SiC Wafer Using Photo-Catalyst Incorporated Pad
Zhou, Yan, Pan, Guoshun, Zou, Chunli, Wang, LeiVolume:
6
Year:
2017
Language:
english
Journal:
ECS Journal of Solid State Science and Technology
DOI:
10.1149/2.0061709jss
File:
PDF, 1.04 MB
english, 2017