Effects of acrylic adhesives property and optimized bonding parameters on Sn 58Bi solder joint morphology for flex-on-board assembly
Zhang, Shuye, Lin, Tiesong, He, Peng, Paik, Kyung-WookVolume:
78
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.08.009
Date:
November, 2017
File:
PDF, 3.19 MB
english, 2017