An efficient reliability testing method combined with thermal performance monitoring
Hantos, G., Hegedüs, J., Rencz, M.Volume:
78
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.08.011
Date:
November, 2017
File:
PDF, 1.83 MB
english, 2017