AIP Conference Proceedings [AIP STRESS MANAGEMENT FOR 3D ICS USING THROUGH SILICON VIAS: International Workshop on Stress Management for 3D ICs Using Through Silicon Vias - Albany, NY, USA - San Francisco, CA, USA - Dresden, Germany (March 16, 2010 - July 13, 2010 - October 20, 2010)] - Multi-Scale Mechanical Probing Techniques To Investigate The Stability Of BEOL Layer Stacks With Sub-100 nm Structures

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