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[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes - Early Power Delivery Analysis of Bump Depopulation
Gan, Houle, Bharath, KrishnaYear:
2013
Language:
english
DOI:
10.1115/IPACK2013-73119
File:
PDF, 1.29 MB
english, 2013