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Investigation of Copper Oxide Ring Formation during Post Chemical Mechanical Polishing Cleaning of Cu Interconnect
Kim, Hojoong, Hong, Seokjun, Jin, Yinhua, Lim, Dong Hyun, Kim, Jun-yong, Hwang, Hasub, Kim, TaesungVolume:
6
Year:
2017
Language:
english
Journal:
ECS Journal of Solid State Science and Technology
DOI:
10.1149/2.0191708jss
File:
PDF, 720 KB
english, 2017