[ASME ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability - San Francisco, California, USA (July 19–23, 2009)] ASME 2009 InterPACK Conference, Volume 2 - Analysis for Single Board Computer Module Cooling Under Natural Air Convection Condition
Zhang, Jiahui, Weber, Dave, Waggel, Jason, Pollice, Tony, Matuonto, MarcoYear:
2009
Language:
english
DOI:
10.1115/interpack2009-89310
File:
PDF, 932 KB
english, 2009