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[IEEE 2017 IEEE International Conference on Advanced Intelligent Mechatronics (AIM) - Munich, Germany (2017.7.3-2017.7.7)] 2017 IEEE International Conference on Advanced Intelligent Mechatronics (AIM) - Development of a distributed Bernoulli gripper for ultra-thin wafer handling
Liu, Dong, Liang, Wenyu, Zhu, Haiyue, Teo, Chek Sing, Tan, Kok KiongYear:
2017
Language:
english
DOI:
10.1109/AIM.2017.8014028
File:
PDF, 804 KB
english, 2017