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Monolithic Integration of a Micropin-Fin Heat Sink in a 28-nm FPGA
Sarvey, Thomas E., Zhang, Yang, Cheung, Colman, Gutala, Ravi, Rahman, Arifur, Dasu, Aravind, Bakir, Muhannad S.Year:
2017
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2017.2740721
File:
PDF, 3.81 MB
english, 2017