A Scalable Multi-Functional Thermal Test Chip Family:...

Journal of Electronic Packaging 2001 Vol. 123; Iss. 4

A Scalable Multi-Functional Thermal Test Chip Family: Design and Evaluation

Benedek, Zs., Courtois, B., Farkas, G., Kollár, E., Mir, S., Poppe, A., Rencz, M., Székely, V., Torki, K.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
123
Year:
2001
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1389846
File:
PDF, 1.30 MB
english, 2001
Conversion to is in progress
Conversion to is failed