Analyzing and modeling methods for warpages of thin and large dies with redistribution layer
Dote, Aki, Kitada, Hideki, Mizushima, Yoriko, Nakamura, Tomoji, Sakuyama, SeikiVolume:
55
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.7567/JJAP.55.06JC03
Date:
June, 2016
File:
PDF, 3.05 MB
english, 2016