Analyzing and modeling methods for warpages of thin and...

Analyzing and modeling methods for warpages of thin and large dies with redistribution layer

Dote, Aki, Kitada, Hideki, Mizushima, Yoriko, Nakamura, Tomoji, Sakuyama, Seiki
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Volume:
55
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.7567/JJAP.55.06JC03
Date:
June, 2016
File:
PDF, 3.05 MB
english, 2016
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