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Vertical cracking of Cu-Sn solid-liquid interdiffusion bond under thermal shock test
Rautiainen, Antti, Vuorinen, Vesa, Li, Jue, Paulasto-Kröckel, MerviVolume:
4
Year:
2017
Language:
english
Journal:
Materials Today: Proceedings
DOI:
10.1016/j.matpr.2017.08.002
File:
PDF, 1.33 MB
english, 2017