Reliability study of package-on-package stacking assembly...

Microelectronics Reliability 2017 / 11 Vol. 78

Reliability study of package-on-package stacking assembly under vibration loading

Xia, Jiang, Cheng, LanXian, Li, GuoYuan, Li, Bin
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Volume:
78
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.09.012
Date:
November, 2017
File:
PDF, 3.69 MB
english, 2017
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