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[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - Front-side mid-level Tungsten TSV integration for high-density 3D applications
Mattis, Brian, Soirez, Lovelace, Bullock, Catherine, Martini, Dave, Jensen, Sara, Levy, James, Jones, AdamYear:
2016
Language:
english
DOI:
10.1109/3dic.2016.7970008
File:
PDF, 1.29 MB
english, 2016