[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - SOP Embedded Thin Film Resistors on High and Low Loss Thin Film Dielectrics
Bhattacharya, Swapan, Varadarajan, Mahesh, Chahal, Premjeet, Lee, K. J., Bhattacharjee, Ajanta, Tummala, Rao R., Sitaraman, Suresh, Papapolymerou, John, Tentzeris, Manos, Laskar, JoyYear:
2005
Language:
english
DOI:
10.1115/IPACK2005-73500
File:
PDF, 465 KB
english, 2005