Impact of thermal aging on the intermetallic compound...

Impact of thermal aging on the intermetallic compound particle size and mechanical properties of lead free solder for green electronics

Aamir, Muhammad, Muhammad, Riaz, Ahmed, Naseer, Waqas, Muhammad
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Volume:
78
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.09.022
Date:
November, 2017
File:
PDF, 4.02 MB
english, 2017
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