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Effect of bonding time on the microstructure and mechanical properties of Co/Sn/Cu joint
Du, Chengchao, Wang, Xue, Tian, ShuangLanguage:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-017-7934-y
Date:
October, 2017
File:
PDF, 4.04 MB
english, 2017