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Direct diffusion bonding of immiscible tungsten and copper at temperature close to Copper's melting point
Zhang, Jie, Huang, Yuan, Liu, Yongchang, Wang, ZuminLanguage:
english
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2017.10.052
Date:
October, 2017
File:
PDF, 1.74 MB
english, 2017