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Electrodeposition of copper for three-dimensional metamaterial fabrication
Yang, Shendu, Thacker, Zachary, Allison, Evan, Bennett, Megan, Cole, Nicholas, Pinhero, PatrickLanguage:
english
Journal:
ACS Applied Materials & Interfaces
DOI:
10.1021/acsami.7b04721
Date:
October, 2017
File:
PDF, 5.55 MB
english, 2017