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[IEEE 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL (2017.5.30-2017.6.2)] 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - A study of direct liquid cooling for high-density chips and accelerators
Gao, Tianyi, Shao, Shuai, Cui, Yan, Espiritu, Bryan, Ingalz, Charles, Tang, Hu, Heydari, AliYear:
2017
DOI:
10.1109/ITHERM.2017.7992537
File:
PDF, 573 KB
2017