[ASME ASME 2010 International Mechanical Engineering Congress and Exposition - Vancouver, British Columbia, Canada (November 12–18, 2010)] Volume 4: Electronics and Photonics - Voiding and Thermal Resistance Modeling and Characterization for a QFN Assembly
Gadepalli, Harish, Dhanasekaran, Rangaraj, Ramkumar, S. Manian, Jensen, Tim, Briggs, EdYear:
2010
Language:
english
DOI:
10.1115/IMECE2010-38391
File:
PDF, 1.16 MB
english, 2010