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Temperature-dependent interface characteristic of silicon wafer bonding based on an amorphous germanium layer deposited by DC-magnetron sputtering
Ke, Shaoying, Lin, Shaoming, Ye, Yujie, Mao, Danfeng, Huang, Wei, Xu, Jianfang, Li, Cheng, Chen, SongyanLanguage:
english
Journal:
Applied Surface Science
DOI:
10.1016/j.apsusc.2017.10.150
Date:
October, 2017
File:
PDF, 267 KB
english, 2017