[IEEE 2017 75th Device Research Conference (DRC) - South Bend, IN, USA (2017.6.25-2017.6.28)] 2017 75th Annual Device Research Conference (DRC) - BEOL compatible 2D layered materials as ultra-thin diffusion barriers for Cu interconnect technology
Lo, Chun-Li, Zhang, Shengjiao, Shen, Tingting, Appenzeller, Joerg, Chen, ZhihongYear:
2017
Language:
english
DOI:
10.1109/DRC.2017.7999485
File:
PDF, 285 KB
english, 2017