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[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer
Saiki, Naoya, Komasu, Yuichiro, Aizawa, Kazuto, Maeda, JunYear:
2017
Language:
english
DOI:
10.1115/IPACK2017-74010
File:
PDF, 1.68 MB
english, 2017