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[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow
Wang, Jing, Niu, Yuling, Park, SeungbaeYear:
2017
Language:
english
DOI:
10.1115/IPACK2017-74017
File:
PDF, 1.61 MB
english, 2017