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[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Two-Phase Mini-Thermosyphon for Cooling of Datacenters: Experiments, Modeling and Simulations
Ong, Chin L., Amalfi, Raffaele L., Marcinichen, Jackson B., Lamaison, Nicolas, Thome, John R.Year:
2017
Language:
english
DOI:
10.1115/IPACK2017-74030
File:
PDF, 1.72 MB
english, 2017