[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - The Performance Enhancement of a Heat Pipe for Power Electronics Cooling With a Partially Applied Hybrid Wick
Boo, Joon Hong, Kim, Hyun Gon, Han, Chang WooYear:
2017
Language:
english
DOI:
10.1115/IPACK2017-74095
File:
PDF, 2.51 MB
english, 2017