[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Experimental Investigation of Parameters Affecting Performance of Pulsating Heat Pipe
Kathait, Pawan Singh, Sharma, Rajnish N.Year:
2017
Language:
english
DOI:
10.1115/IPACK2017-74119
File:
PDF, 1.47 MB
english, 2017