![](/img/cover-not-exists.png)
[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Peel-and-Stick Sensors Powered by Directed RF Energy
Lalau-Keraly, Christopher, Daniel, George, Lee, Joseph, Schwartz, DavidYear:
2017
Language:
english
DOI:
10.1115/IPACK2017-74150
File:
PDF, 1.41 MB
english, 2017