![](/img/cover-not-exists.png)
[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management
Yates, Luke, Cheaito, Ramez, Sood, Aditya, Cheng, Zhe, Bougher, Thomas, Asheghi, Mehdi, Goodson, Kenneth, Goorsky, Mark, Faili, Firooz, Twitchen, Dan, Graham, SamuelYear:
2017
Language:
english
DOI:
10.1115/IPACK2017-74163
File:
PDF, 1.65 MB
english, 2017