[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Lead-Free Alternatives for Interconnects in High-Temperature Electronics
Mallampati, Sandeep, Yin, Liang, Shaddock, David, Schoeller, Harry, Cho, JunghyunYear:
2017
Language:
english
DOI:
10.1115/IPACK2017-74169
File:
PDF, 2.63 MB
english, 2017