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[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Preliminary Results on the Fabrication of Interconnect Structures Using Microscale Selective Laser Sintering

Roy, Nilabh, Dibua, Obehi, Foong, Chee Seng, Cullinan, Michael
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Year:
2017
Language:
english
DOI:
10.1115/IPACK2017-74173
File:
PDF, 2.68 MB
english, 2017
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