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[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Thermo-Mechanical Study of AlN Thin-Films As Heat Spreaders in III-V Photonic Devices
Lei, Shenghui, Kardemir, Ertugrul, McCloskey, David, Donegan, John F., Enright, RyanYear:
2017
Language:
english
DOI:
10.1115/IPACK2017-74184
File:
PDF, 2.85 MB
english, 2017