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[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches
Rzepka, Sven, Otto, Alexander, Vogel, Dietmar, Dudek, RainerYear:
2017
Language:
english
DOI:
10.1115/IPACK2017-74208
File:
PDF, 2.61 MB
english, 2017