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[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices
Morgan, Adam, Choobineh, Leila, Fresne, David, Hopkins, Douglas C.Year:
2017
Language:
english
DOI:
10.1115/IPACK2017-74222
File:
PDF, 3.07 MB
english, 2017