[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Design Analysis and Performance Evaluation of a Data Center With Indirect Evaporative Cooling
Tavakkoli, Fatemeh, Ebrahimi, Siavash, Sun, Xiaogang, Cui, Yan, Heydari, AliYear:
2017
Language:
english
DOI:
10.1115/IPACK2017-74295
File:
PDF, 2.58 MB
english, 2017