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Integrity monitoring of adhesively bonded joints via an electromechanical impedance-based approach
Zhuang, Yitao, Kopsaftopoulos, Fotis, Dugnani, Roberto, Chang, Fu-KuoLanguage:
english
Journal:
Structural Health Monitoring: An International Journal
DOI:
10.1177/1475921717732331
Date:
October, 2017
File:
PDF, 2.77 MB
english, 2017