Intermetallic compounds in 3D integrated circuits...

Science and Technology of Advanced Materials 2017 / 12 Vol. 18; Iss. 1

Intermetallic compounds in 3D integrated circuits technology: a brief review

Annuar, Syahira, Mahmoodian, Reza, Hamdi, Mohd, Tu, King-Ning
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Volume:
18
Language:
english
Journal:
Science and Technology of Advanced Materials
DOI:
10.1080/14686996.2017.1364975
Date:
December, 2017
File:
PDF, 1.33 MB
english, 2017
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