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A Global–Local Approach for Mechanical Deformation and Fatigue Durability of Microelectronic Packaging Systems
Zhang, T., Rahman, S., Choi, K. K., Cho, K., Baker, P., Shakil, M., Heitkamp, D.Volume:
129
Year:
2007
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2721092
File:
PDF, 1.61 MB
english, 2007